gold solder
英 [ɡəʊld ˈsəʊldə(r)]
美 [ɡoʊld ˈsɑːdər]
网络 金焊; 金焊条; 金焊料
双语例句
- If the metal that was under the gold is not oxidized, the gold-contaminated solder will bond to it.
如果镀金层覆盖的金属没有氧化，则带有金成分的焊料将会粘连在该金属上。 - This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。 - Influence of Gold Addition on the Performance of Sn_ ( 63) Pb_ ( 37) Eutectic Solder
金对Sn（63）Pb（37）共晶钎料性能的影响 - Central processing unit ( CPU), a significant electronic component with a high gold content, was taken in experiment. CPU was pre-processed by centrifugal separation, solder smelting and vacuum pyrolysis to separate the pins from the base plates.
以中央核处理器（CPU）这一典型的金含量高的电子废弃物为实验对象，采用油浴离心分离法、熔锡法及真空热解法对CPU进行预处理以实现针脚的分离。